Teledyne FLIR Simplifies Embedded System Integration with New Boson + Thermal Resolution Options, Radiometry, and MIPI Interface

Teledyne FLIR, a subsidiary of Teledyne Technologies Incorporated, has announced the expansion of the Boson+ thermal camera module product line, offering twenty-four compact models with 320 x 256 resolution. Radiometry, the ability to take the temperature of every pixel, is now available on all resolutions, as well as both MIPI and CMOS interfaces. The Boson+ boasts a thermal sensitivity of 20 millikelvin (mK) or less, making it the most sensitive longwave infrared (LWIR) camera line on the market, ideal for integration in unmanned ground vehicles (UGV), unmanned aircraft systems (UAS), automotive, wearables, security applications, handhelds, and thermal sights.

“Customers can now choose between USB, CMOS, or MIPI video interfaces, making it easier than ever to integrate Boson+ with a wide range of embedded processors from Qualcomm, Ambarella, and more,” said Dan Walker, Vice President of Product Management, OEM Cores, Teledyne FLIR.

The Boson+ features 640 x 512 and 320 x 256 resolutions utilizing the latest 12-micron pixel pitch thermal detector, all within a size, weight, and power (SWaP) optimized package. The enhanced detection, recognition, and identification (DRI) performance of the Boson+ is made possible by the noise equivalent differential temperature (NEDT) of 20 mK or less. The improved automatic gain control (AGC) and video latency of the Boson+ result in enhanced scene contrast and sharpness while improving tracking, seeker performance, and decision support.

Teledyne FLIR’s Boson+ is available with a variety of lens options, comprehensive product documentation, an easy-to-use software development kit (SDK), and a user-friendly graphical user interface (GUI). Additionally, the Boson+ is classified under the US Department of Commerce jurisdiction as EAR 6A003.b.4.a and is available for purchase globally from Teledyne FLIR and its authorized dealers.

Customers can receive integration support from the US-based Teledyne FLIR Technical Services team, reducing development risk and shortening time to market. Those interested can visit the SPIE Defense and Commercial Sensing Exhibition in Orlando, Florida, from May 2-4, 2023, or AUVSI Xponential in Denver, Colorado, from May 9-11, 2023, to view the Boson+ thermal camera modules in person at booths #1003 and #1811, respectively.

About Teledyne FLIR
Teledyne FLIR, a Teledyne Technologies company, is a world leader in intelligent sensing
solutions for defense and industrial applications with approximately 4,000 employees worldwide.
Founded in 1978, the company creates advanced technologies to help professionals make
better, faster decisions that save lives and livelihoods.

For more information, please visit www.teledyneflir.com

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