CEVA, announced today a partnership with LG Electronics, a global leader in consumer electronics and appliances, to deliver a high-performance, low-cost smart 3D camera solution for consumer electronics and robotic applications.
The 3D camera module incorporates a Rockchip RK1608 coprocessor with multiple CEVA-XM4 imaging and vision DSPs, which provide the processing power to perform a wide variety of 3D sensing applications. These include biometric face authentication, 3D reconstruction, gesture/posture tracking, obstacle detection, AR and VR. Computer vision experts from CEVA, Rockchip and LG worked closely together to optimize LG’s proprietary algorithms for the CEVA-XM4 using CEVA’s tool kit and optimized algorithm libraries ensuring optimal performance under stringent power constraints.
“There is a clear demand for cost-efficient 3D camera sensor modules to enable an enriched user experience for smartphones, AR and VR devices and to provide a robust localization and mapping (SLAM) solution for robots and autonomous cars,” said Shin Yun-sup, principal engineer at LG Electronics. “Through our collaboration with CEVA, we are addressing this demand with a fully-featured compact 3D module, offering exceptional performance thanks to our in-house algorithms and the CEVA-XM4 imaging and vision DSP.”
“We’re delighted to announce our collaboration with LG for the 3D camera module market,” said Ilan Yona, vice president and general manager of the Vision Business Unit at CEVA. Our CEVA-XM family of imaging and vision DSPs and software development environment allows companies like LG to deploy their in-house developed computer vision and deep learning technologies quickly and efficiently.”
LG will be presenting and demonstrating their smart 3D module at the CEVA Technology Symposium Series in Chinaand Taiwan, October 23rd to October 27th, 2017. Visitors can meet computer vision experts from CEVA and LG at these events. For more information on how to register, please visit the Symposium website at http://events.ceva-dsp.com/symposium-2017-en/.
CEVA’s latest generation imaging and vision DSP platforms address the extreme processing requirements and low power constraints of the most sophisticated machine learning and machine vision applications used in smartphones, surveillance, augmented reality, sense and avoid drones and self-driving cars. These DSP-based platforms include a hybrid architecture composed of scalar and vector DSP processors coupled with a comprehensive Application Development Kit (ADK) to streamline software deployment. The CEVA ADK includes: CEVA-Link for seamless software level integration with a host processor; a range of widely used and optimized software algorithms; the CEVA Deep Neural Network (CDNN2) real-time Neural Network software framework which streamlines machine learning deployment at a fraction of the power consumption of the leading GPU-based systems, and; state-of-the-art development and debugging tools. For more information, visit http://www.ceva-dsp.com/app/imaging-computer-vision/.
About CEVA, Inc.
CEVA is the leading licensor of signal processing IP for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and machine-to-machine devices, advanced imaging, computer vision and deep learning for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For connectivity, we offer the industry’s most widely adopted IPs for Bluetooth (low energy and dual mode), Wi-Fi (802.11 a/b/g/n/ac up to 4×4) and serial storage (SATA and SAS).
For more information visit www.ceva-dsp.com